Packaging of OAM Devices: Main Achievements
When dealing with integrated components design and development, packaging is the action that makes them suitable for practical use in experiments and field trials.
In ROAM project, after a first characterization and exploitation of the photonic integrated chips in the laboratories on optical tables able to control vibrations, the OAM devices will be packaged to
allow their use outside the lab.
The packaging activity carried on in the project can have significant impact on the development of devices to be employed for industrial appications.
CNIT and IBM will bring expertise in packaging of the integrated devices to make them suitable for practical use in experiments and field trials.
The packaging of the various integrated devices with the OAM fibres will allow to provide compact and robust modules for the system evaluation.
The packaged modules will also include the thermal control and stabilisation of the chip and the electrical biasing, including the fast modulation of the OAM mode emission.
Because this task is key to the system evaluation, both IBM and CNIT will be developing packaged modules over the whole duration of the project.
A new set of packaged OAM chip delivered!
CNIT and Scuola Superiore Sant'Anna advanced packaging laboratory delivered two packaged chips to be used in the ROAM field trials.
Several chips were designed and fabricated by the James Watt Nanofabrication Centre at the University of Glasgow by Research Assistant Ning Zhang, and Charalambos Klitis from Prof. Marc Sorel group.
The chips were designed to include thermal controller to act on the ring radius and tune the OAM mode to be emitted on various wavelenghts.
Dr. Veronica Toccafondo packaged two of the delivered devices under the supervision of Dr. Giovanbattista Preve.
First packaging of OAM chip succesfully delivered!
The chip, designed and fabricated by the James Watt Nanofabrication Centre at the University of Glasgow,
was packaged by the Laboratory of Advanced Packaging at CNIT and Scuola Superiore Sant'Anna.
The chip contains several silicon photonic integrated circuits that can simultaneously emit up to 8 tunable OAM beams.
Such packaged device will be a key enabler for several optical system experiments, including OAM multiplexing in optical fibres and OAM-based optical switches.